Scholarship at Malaysian Institutions of Higher Learning 2018

The Kuala Lumpur Kepong Berhad now invites scholarship applications from qualified and deserving individuals seeking financial assistance in pursuing their full-time undergraduate studies in Malaysian institutions of higher learning.

Yayasan KLK Undergraduate Scholarship at Malaysian Institutions of Higher Learning

 

Kuala Lumpur Kepong Berhad (“KLK”) is a company incorporated in Malaysia and listed on the Main Market of Bursa Malaysia Securities Berhad with a market capitalisation of approximately RM26.7 billion at the end of December 2017.

Scholarship Description:

  • Applications Deadline: August 24, 2018
  • Course Level: Scholarship is available to pursue undergraduate programme.
  • Study Subject: Scholarship is awarded in the fields of:
    1. Agricultural Sciences or related disciplines
    2. Sciences (Chemistry, Biotech)
    3. Engineering (Chemical, Mechanical, Civil, Electrical & Electronics)
    4. Accountancy
    5. Information Technology
    6. Architecture
    7. Real Estate Management
    8. Town & Regional Planning
  • Scholarship Award: Scholarship of value Degree: RM10, 000 per academic year.
  • Nationality: Scholarship is available for Malaysian citizens.
  • Number of ScholarshipsNumbers not given
  • Scholarship can be taken in Malaysia

 

Read More: 15 fully funded swansea university research excellence scholarship in uk 

Eligibility for the Scholarship:

Eligible Countries: Scholarship is available for Malaysian citizens.

Entrance Requirements: Applicants must meet the following criteria:

  • Must be a Malaysian citizen
  • Good academic results (STPM, A-Levels or equivalent minimum 2As / Foundation-minimum CGPA of 3.5)
  • Good command of English both written and spoken
  • A record of active participation in extracurricular activities
  • Must have a confirmed placement from institutions of higher learning
  • Not bonded, holding any other scholarship or receiving assistance from any organisation
  • Be prepared to serve a 3 year bond with the Group at any location upon graduation.

 

Application Procedure:

 

How to Apply:

 Download the application form. The completed form, certificates and offer letter from the institution are to be sent by post.

Scholarship Link

No comments

Leave a Reply

Your email address will not be published.

yoast seo premium free